A flexible but tough potting compound which adheres to most surfaces.The material's low viscosity enables fine reproduction, good penetration and fast air removal before curing., Ideal for delicate electronic components requiring protection with flexibility and restraint.Vacuum degassing during cure will further reduce entrapped air. Handling represents minimal contact hazard.,Cure time: 24 hours @25°C; ,0.25 hours @100°C

Do not deviate from the 2.5:1 mix ratio.

Potting Compounds

The Potting Compounds are pourable two-part compounds for potting and encapsulating electronic circuits and components. They protect against moisture and corrosion and improve insulation resistance and mechanical strength. They may be cured at room temperature, or oven cured. Use silicone oil aerosol as a mould release agent. Full instructions supplied with each pack.