Thermal bonding epoxy adhesive,20ml
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Specifications
| Cure Time | 48 h | |
| Maximum Operating Temperature | +120°C | |
| Minimum Operating Temperature | -40°C | |
| Package Size | 20 ml | |
| Package Type | Syringe | |
| Product Material | Epoxy | |
| Thermal Conductivity | 1.1W/m°C | |
| Type | Thermal Conductive Compound |
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Electrolube 2 Part Thermal Bonding Epoxy
Two part, metal oxide loaded, thermal bonding system
Can be used to bond heat sinks assemblies in "piggy back" arrangements, assembly of complex heat sink and as a bonding medium in surface mounting assemblies
Excellent electrical insulation properties
Solvent free system ensures that mated surfaces cannot come into contact, ensuring no electrical leakage through the bond
Extremely thin curing coating of approx 200 microns
Bonds a wide range of surfaces; dissimilar metals, epoxies, acrylics, polycarbonates etc.
Room temperature curing. Mix ratio 3 to 1. Usable life when mixed: 3 to 4 hours
Specific heat capacity: 0.5cal/g/°C @ 30°C resin, 0.35cal/g/°C @ 30°C hardener
Cure time: 8 to 12 hrs @Room Temp; Hard 48 hrs @Room Temp; Full Cure 45 mins @100°C
Tensile strength 2200N/cm² Resistivity 1014 – 1015 Ω cm