Insulating,thermally conductive,Bond Ply 100 (5 mil thick) 1" x 1" square pad
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Technical Reference
| Statement of Conformity | Pages | |
|---|---|---|
| Statement of conformity | 1 | |
| Data Sheet | Pages | Size |
| Bond Ply 100 Data Sheet | 1 | 139kB |
Note: If you experience problems downloading PDF documents, un-check 'Page at a time download' below.Page at a time download |
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Attributes
| Attribute Type | Attribute Value |
|---|---|
| Package Outline | 25.4 x 25.4 mm |
| Thickness | 0.127mm |
| Thermal Conductivity | 0.8W/m•K |
| Operating Temperature | -30 → +120°C |
| Breakdown Voltage | 3000Vac |
Overview
Bond-Ply 100
Bond-Ply 100 is thermally conductive, double-sided pressure sensitive adhesive tape. It is designed to attain high bond strength with long term exposure to moderate heat and high humidity. Can be used instead of Heat Cure Adhesives, Screw Mounting, Clip Mounting. Available in four different sizes.
Uses include:
- Mounting heatsink to BGA graphic processor
Mounting heatsink onto computer processor
Mounting heatsink onto drive processor
Range Overview
Thermally Conductive Insulators (Heatsinks)
Insulating,thermally conductive,Bond Ply 100 (5 mil thick) 1" x 1" square pad
Birchington Road, Corby, Northants, NN17 9RS, UK